... FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3333 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.FeaturesPower Supply: VDD=1.2V TypicalVDDQ = 1.2V TypicalVisually striking colours help you immediately spot keysVDDSPD=2.2V to 3.6VOn-Die termination (ODT)16 internal banks; 4 groups of 4 banks eachBi-directional Differential Data Strobe8-bit pre-fetchBurst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)Height 1.661 inches (42.20mm)Extra InfoMemory Size: 32768MBModule Size: 16384MBMemory Type: DDR4Memory Package: DIMMPin Configuration: 288 pinsMain Colour: Black