... FBGA components per module. Each module kit supports Intel Extreme
Memory Profiles (Intel XMP) 2.0. Total capacity is 32GB. Each module has
been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at
1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400
timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.


Features



Power Supply: VDD=1.2V Typical



VDDQ = 1.2V Typical



VPP - 2.5V Typical



VDDSPD = 2.4V to 3.3V



On-Die termination (ODT)



16 internal banks; 4 groups of 4 banks each



Bi-directional Differential Data Strobe



8-bit pre-fetch



Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)



HyperX Infrared Sync working distance 18mm



Factory preset RGB wave lighting effect



Height 1.661 inches (42.20mm)



Specification:
- CPU Compatibility: Intel Skylake / Kabylake / Coffeelake ( LGA 1151 )
& Ryzen (AM4)
- Chipset: Intel Chipsets & AMD Chipsets
- Capacity: 32GB (8GBx4)
- Quad Channel kit: Yes
- Tested Speed: DDR4-3200 MHz (PC4-25600)
- Tested Latency: 16-16-16-36
- Tested Voltage: 1.35V
- Registered/Unbuffered: Unbuffered
- Error Checking: Non-ECC
- Type: 288-pin UDIMM
- SPD Speed: 2133 MHz
- SPD Voltage: 1.2V
- Warranty: Lifetime


Extra Info



Memory Size: 32768MB



Module Size: 8192MB



Memory Type: DDR4



Memory Package: DIMM



Pin Configuration: 288 pins



Main Colour: Black